Second Call for Papers
2026 EUVL and Source Workshop
Abstracts Due Date: March 20, 2026
The 2026 EUVL and Source Workshop, organized by EUV Litho, Inc. and co-hosted by EUV Tech, Molecular Foundry and the BETR Center at UC Berkeley, with support from the CH3IP consortium, will bring together the global community working on EUV Lithography, EUV and Soft X-ray Sources, and the supporting ecosystem that enables advances in semiconductor manufacturing, for continued extension of Moore’s law. This workshop will cover the full spectrum of topics relevant to EUVL, high-NA EUVL and hyper-NA EUVL lithography, advanced source technology, materials, metrology, and the extension of lithography to wavelengths below 13.5 nm.
With EUVL scanners in high-volume manufacturing at the 3 nm and 2 nm nodes and beyond, this workshop will address lowering of the k1 value, enabling of infrastructure, addressing challenges for high-NA EUVL scanners, and exploring options beyond high-NA. The program will also highlight emerging directions that may support semiconductor manufacturing to 2030 and beyond, including hyper-NA lithography at 13.5 nm and Blue-X lithography at wavelengths from 2 to 7 nm. Papers are also invited on the use of AI and machine learning for semiconductor technology development.
In addition to technical presentations, the program will incorporate a Supplier Showcase that brings together suppliers, researchers, and end-users for detailed discussions of technologies, specifications and challenges. This integrated format fosters close interaction among all participants and encourages the exchange of ideas across the EUV and source communities.
Confirmed Keynote Speakers
Additional keynote speakers to be announced!
Confirmed Invited Speakers
List of Topics
Abstracts are invited across all areas of relevance to EUVL, EUV and Soft X-ray Sources and Next-Generation Lithography. Topics include, but are not limited to:
- EUV and metrology source technology including LPP, DPP, HHG, FEL, synchrotrons, and new concepts
- High power source development, source diagnostics, and source metrology
- Optics and optical design, including projection optics, collector optics, and multilayer coatings
- EUV mask technology, including pellicles, absorber materials, cleaning, and defect mitigation
- Resists and underlayers, stochastic effects, pattern collapse, and line edge roughness
- Contamination, cleaning strategies, and lifetime management for sources, masks, and optics
- Metrology and inspection for masks, resists, optics, stochastic analysis, and pattern fidelity
- Patterning, process integration, and design for manufacturability
- Lithography at wavelengths below 13.5 nm (Blue-X, 2 to 7 nm), including sources, optics, optical design, masks, and photoresists
- Shorter wavelength source applications for scanners, metrology, microscopy, and analytical instrumentation
- Theoretical and modeling studies relevant to EUVL, sources, and next-generation lithography
- Applications of AI and machine learning across lithography, patterning, source science, and semiconductor manufacturing technology
Agenda Overview
The June 6-7, 2026 short courses will be held online only. The June 8-11, 2026 workshop will be held in In-person only at the Pauley Ballroom, UC Berkeley, Berkeley, California, USA
- June 6–7, 2026: Two online short courses
- June 8, 2026 (morning and afternoon): Blue-X Technical Working Group (TWG) meeting (members only), followed by a joint reception for the Blue-X TWG and EUVL and Source Workshop attendees
- June 8–11, 2026
In-person technical presentations, poster session, reception, and conference dinner for the EUVL and Source Workshop
Instructions for Submissions
- Submit an abstract of less than 200 words
- Indicate whether you prefer an oral or poster presentation
- Use the abstract template (available at euvlitho.com) and email submissions to info@euvlitho.com
Abstract Submission Deadline: Friday, March 20, 2026
For logistics questions, email info@euvlitho.com
Workshop Chair
Vivek Bakshi, EUV Litho, Inc. (vivek.bakshi@euvlitho.com)
Workshop Co-Chairs
Patrick Naulleau, EUV Tech (pnaulleau@euvtech.com)
Ricardo Ruiz, Molecular Foundry, LBL (ricardo.ruiz@lbl.gov)
Michael Bartl, UC Berkeley (mbartl@berkeley.edu)
Oscar Versolato, ARCNL (O.Versolato@arcnl.nl)
2025 EUVL and Source Workshop Proceedings Published
The 2025 EUVL and Source Workshop and Blue-X TWG meeting was successfully held from June 23-26,2025 at MIT LL. Online short courses were held from June 21-22, 2025. The workshop proceedings for the 2025 EUVL and Source Workshop are now available at the link below.
Nikon Research Corporation of America (NRCA) Joins Blue-X Consortium to Explore Leading-Edge Lithography at < 13. 5 nm
The Blue-X consortium has recently welcomed six new members, including Nikon Research Corporation of America (NRCA), expanding its collaborative network to explore advanced optical projection lithography at wavelengths below 13.5 nm. EUV Litho, Inc. organizes this consortium as a Technical Working Group (TWG), which now comprises over 65 members who collectively have assigned more than 170 professionals to various sub-TWGs.
Among the distinguished members are major chip manufacturers such as IBM and Intel, along with a mix of large and small original equipment manufacturers (OEMs), National Labs, and independent experts from around the globe. This diverse group aims to push the boundaries of advanced lithography beyond 13.5 nm by harnessing collective expertise and fostering innovation across several specialized sub-TWGs. These sub-groups tackle critical areas, including Imaging and Optical Design, Optics, Mask, Metrology, Resist and Patterning and various Photon Source technologies.
The consortium also is engaging in initiatives such as Resist Evaluations at beamlines, ML optics development, optical design evaluations and Source Evaluations through programs like Flying Circus. These efforts underscore the Blue-X consortium’s dedication to advancing research and technology in the field. Detailed program information will be released soon.
The annual in-person meeting of the Blue-X TWG is scheduled for June 23rd at MIT LL. This event is exclusive to Blue-X TWG members, with a registration deadline of May 23rd. This meeting presents a unique opportunity to engage with leading experts and explore the next wave of technological innovations beyond EUV. Interested parties are encouraged to contact info@euvlitho.com for program updates, white papers, and membership information. The detailed agenda for the meeting, along with information for the 2025 EUVL and Source Workshop, has been announced on www.euvlitho.com.